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TSTM872-20
RF POWER MODULE MOBILE APPLICATIONS
PRODUCT DEVELOPMENT DATA SHEET
This data sheet contains the design criteria and target specifications for a product which is currently under development by SGS-THOMSON. The design criteria and specifications of this item could change prior to introduction and SGS-THOMSON assumes no liability for use of information contained herein.
.MOBI .806 .12. .I .P .GAI
L E CLASS C POWER AMPLIFIER - 870 MHz 5 VOLTS NPUT/OUTPUT 50 OHMS OUT = 20 W MIN. N = 19 dB MIN.
ORDER CODE TSTM872-20
BRANDING TSTM872-20
PIN CONNECTION DESCRIPTION The TSTM872-20 module is designed for high power, high efficiency, analog private mobile radio systems in the 806 - 870 MHz frequency range. A significant advantage of this module is its high RF power output performance and very low standby current.
1. RF Input 4. 12.5 Vdc VS3 2. 12.5 Vdc VS1 5. RF Output 3. 12.5 Vdc VS2
ABSOLUTE MAXIMUM RATINGS (Tcase = 25 C)
Symbol Parameter Value Unit
V S1 , VS 2, VS 3 DC Supply Voltage P IN P OUT T S TG TC RF Input Power RF Output Power Storage Temperature Operating Case Temperature
16 400 25 - 30 to +100 - 30 to +100
Vdc mW W C C
TSTM872-20
ELECTRICAL SPECIFICATIONS (T case = 25 C, VS1 , VS2, VS3 = 12.5 Volts
unless otherwise noted.) Symb ol Parameter T est Con ditio ns Value Min. Typ. Max. Un it
BW P IN I Q1(q) I Q2(q) I Q3
(q)
Frequency Range Input Power Efficiency POUT = 20 W POUT = 20 W
806 -- 35 -- -- -- -- -- V = 16 Vdc
-- -- 40 50 1.0 0.04 -58 --
870 250 -- -- -- -- --
MHz mW % mA mA mA dBc
Quiescent Current No RF applied VS1 Quiescent Current No RF applied VS2 Quiescent Current No RF applied VS3 Harmonics Input Impedance Load Mismatch POUT = 20 W POUT = 20 W VSWR = 30:1 POUT = 25 W
H Z IN --
2.0:1 VSWR
No Degradation in Output Power
INTERNAL CONFIGURATION
TSTM872-20
APPLICATIONS RECOMMENDATIONS
OPERATION LIMITS The TSTM872-20 power module should never be operated under any condition which exceeds the Absolute Maximum Ratings presented on this data sheet. Nor should the module be operated continuously at any of the specified maximum ratings. If the module is to be subjected to one or more of the maximum rating conditions, care must be taken to monitor other parameters which may be affected. DECOUPLING Failure to properly decouple any of the voltage supply pins will result in oscillations at certain operating frequencies. Therefore, it is recommended that these pins be bypassed as indicated in the Module DC and Test Fixture Configuration drawing of this data sheet.
MODULE MOUNTING To insure adequate thermal transfer from the module to the heatsink, it is recommended that a satisfactory thermal compound such as Dow Corning 340, Wakefield 120-2 or equivalent be applied between the module flange and the heatsink. The heatsink mounting surface under the module should be flat to within +/- 0.05 mm (+/- 0.002 inch). The module should be mounted to the heatsink using 3.5 mm (or 6-32) or equivalent screws torques to 5-6 kg-cm (4-6 in-lb). The module leads should be attached to equipment PC board using 180C solder applied to the leads with a properly grounded soldering iron tip, not to exceed 195C, applied a minimum of 2 mm (0.080") from the body of the module for a duration not to exceed 15 seconds per lead. It is imperative that no other portion of the module, other than the leads, be subjected to temperatures in excess of 100C (maximum storage temperature), for any period of time, as the plastic moulded cover, internal components and sealing adhesives may be adversely affected by such conditions. Due to the construction techniques and materials used within the module, reflow soldering of the flange heatsink or leads, is not recommended.
TSTM872-20
PACKAGE MECHANICAL DATA
Ref.: Dwg. No. M12-030 rev. C
Information furnished is believed to be accurate and reli able. However, SGS-THOMSON Microelectr onics assumes no responsibili ty for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result fr om its use. No license is granted by implication or otherwise under any patent or patent rights of S GS-T HOMSON Microelectronics. Specifications mentioned in this publication are subject to change wi thout notice. This publi cati on super sedes and replaces all information previously supplied. SGS-T HOMSON Microelectronics products are not authorized for use as criti cal components in life support devices or systems without express written approval of SGS-THOMSON Mi croelectr onics. (c)1995 SGS-TH OMSON Mi croelectronics - A ll Ri ghts Reserved SGS -T HOMSON Microelectronics GROUP OF COMPANIES Australia - Br azil - Fr ance - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Tai wan - Thailand - United Kingdom - U.S .A.

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